PCB Design and Assembly Can Be Used in High-Temperature
In the electronics industry, PCBs are essential for a wide range of applications. From mobile devices to advanced aerospace systems, modern electronic components require a PCB to carry the electrical signals and power them to operate. Using a PCB in high-temperature environments, however, presents unique challenges that require special considerations during design and assembly.
The main cause of circuit board failure is temperature, which accounts for up to 55% of the total number of components that fail. To mitigate this, engineers should use a pcb design & assembly that can withstand higher temperatures to reduce the failure rate. This requires careful consideration of the component placement, thermal design, and assembly process, as well as selecting the right materials for the job.
Standard FR-4 (Flame Retardant 4) epoxy-based laminates and substrates can withstand normal operating temperatures, but they may not be suitable for high-temperature applications. To achieve high-temperature stability, a PCB manufacturer should consider using specialty materials, such as Rogers (hydrocarbon ceramic laminates) or polyimide-based laminates (like Kapton). Additionally, the material thickness and copper weight should be increased to increase thermal conductivity and maintain stable electrical performance.
During assembly, PCBs should be designed to accommodate thermal expansion and contraction. This is achieved by strategically placing heat-generating components and ensuring that adequate space is left for heat dissipation. PCB layout should also minimize hot spots and ensure that heat is distributed evenly across the board.
How PCB Design and Assembly Can Be Used in High-Temperature Applications
A major concern in high-temperature applications is the risk of solder joint failure. Solder joints can be affected by changes in the board’s temperature, as well as thermal cycling and prolonged exposure to extreme temperatures. This can lead to corrosion, cracking, or embrittling of the elastic materials that make up the joint.
To prevent this, a PCB designer should include thermal vias in the layout to dissipate excess heat from high-current components. In addition, the thickness and height of traces and vias should be carefully controlled to prevent excessive thermal stress. Finally, engineers should be mindful of the environmental conditions in which the PCB will be used and consider using a conformal coating to protect against moisture and dust.
During PCB design, it is important to follow industry norms when choosing component footprints. Doing so improves manufacturability by improving cross-vendor compatibility and enabling automated pick-and-place processes. Furthermore, engineers should use components that have a high level of placement tolerance to reduce the error rate in assembling the board. This will decrease tomb-stoning issues and other assembly errors. Additionally, implementing machine vision type feedback in the manufacturing process can further help to reduce assembly errors. All of these factors can have a significant impact on the production yields of a circuit board.
Proper power distribution ensures that all components receive a stable power supply. Designers must plan power and ground planes to minimize voltage drops and noise. Decoupling capacitors should be placed close to power pins of integrated circuits (ICs) to filter out noise and stabilize the power supply. Power traces should be wide enough to handle the current requirements without excessive heating.
